Contact hole shrink process using graphoepitaxial directed self-assembly lithography
نویسندگان
چکیده
منابع مشابه
Electrical Via Chain Yield for DSA Contact Hole Shrink Process
In this study, we conducted electrical via chain yield tests for the purpose of verifying the total process performance of directed self-assembly (DSA) contact hole shrink process. DSA was utilized on the via level connecting between two metal levels. From the analysis of single via resistance data, the best process condition was determined and the via chain yield was obtained. The best yield w...
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ژورنال
عنوان ژورنال: Journal of Micro/Nanolithography, MEMS, and MOEMS
سال: 2013
ISSN: 1932-5150
DOI: 10.1117/1.jmm.12.3.033011